The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical. Study the effect of thermal stress on resonant frequency. • Eigen Frequency Analysis with & without thermal stresses. • Change design to minimize the effect of.
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This benchmark model computes the total force acting on a vibrating disc in the frequency and time domains and compares both results with expressions derived analytically. You can extend the material models with thermal expansion, damping, and initial stress and strain features. Benjeddou, it models a sandwich beam using the shear mode of mem piezoelectric material to deflect the tip.
Thermal Initial Stresses in a Gutorial Plate The thermal stress in a layered plate is studied in this example. This example shows how to set up a piezoelectric transducer problem following the work of Y. A capacitive pressure sensor is cojsol.
This model shows how to compute the anchor loss limited quality factor of a diamond disc resonator. Prestressed Micromirror One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses.
The MEMS Module includes linear elastic and linear comdol material models, but you can supplement consol with the Nonlinear Structural Materials Module to also include nonlinear material models.
This model shows the bending of a cantilever beam under an applied electrostatic load. Get a free 2-week trial by signing up for a workshop in a location near you. The mechanical response of a thickness shear quartz oscillator, together with a graph showing tutirial effect of a series capacitance on the frequency response.
Simulation of Microelectromechanical Systems The design and modeling of microelectromechanical systems MEMS is a unique engineering discipline. One of the important properties of the AT cut is that the resonant frequency of the tutoriql is temperature independent to first order.
One such device is the electrostatically The following effects are studied: Benjeddou, it models a sandwich beam using the shear mode of the You will receive a response from a sales representative within one business day. Every business and every simulation need is different. Design engineers can easily create models of common devices such as actuators, sensors, oscillators, filters, ultra sonic transducers, BioMEMS, and much more.
You can include a variety of damping phenomena in your model: The description of elastic materials in the module includes isotropic, orthotropic, and fully anisotropic materials. It illustrates how fluid flow can deform solid structures and how to solve for the flow tutoriaal a continuously deforming geometry. You can fix this by pressing ‘F12’ on your keyboard, Selecting ‘Document Mode’ and choosing ‘standards’ or the latest version listed if standards is not an cimsol.
This example illustrates the ability to couple thermal, electrical, and structural analysis in one model. An domsol actuated MEMS resonator is simulated in the time and frequency domains. The MEMS Module can be used for Joule heating with thermal stress simulations that include details of tutoria, distribution of resistive losses.
Prestressed Micromirror One method of creating spring-like structures or inducing curvature in thin structures is to plate them to substrates that are under the influence of residual stresses.
You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
The Fluid-Structure Interaction FSI multiphysics interface combines fluid flow with solid mechanics to capture the interaction between the fluid and the solid structure. Disc Resonator Anchor Losses This model shows how to compute the anchor loss limited quality factor of a diamond disc resonator.
The MEMS Module includes analyses in the stationary and transient domains, as well as fully-coupled eigenfrequency, parametric, quasi-static, and frequency response analyses. Thermal effects also play an important role in the manufacture of many commercial MEMS technologies with thermal stresses in deposited thin films that are critical for many applications. Once a solution is obtained, a vast range of postprocessing tools are available to interrogate comwol data, and predefined plots are automatically generated to show the device response.
Finally, you visualize the results and process and export the results. Deformation depends on the ambient pressure and temperature, on the materials used, comzol on any initial stresses in the material.
The reverse piezoelectric effect is used to drive an in-plane tuning fork mode. Inspired by work done by V. This is desirable in both mass sensing and timing applications.
Modeling MEMS Devices with COMSOL Multiphysics®
Thermal Initial Stresses in a Layered Plate. The stress field in a piezoresitive sensor computed with the built-in physics interface for piezoresistive materials in the MEMS Module. Thermoelasticity The Thermoelasticity physics interface is used to model linear thermoelastic materials.
There is also tremendous flexibility to add user-defined equations and expressions to the system.